文章信息/Info

Title:

Thermal behavior analysis of thin-walled cylinder structure during forming process based on SLM

作者:

杜世浩; 高雪強(qiáng); 劉釗; 丁晨陽(yáng); 韓志杰

河北科技大學(xué) 機(jī)械工程學(xué)院，河北 石家莊 050018

Author(s):

Author DU Shihao; GAO Xueqiang; LIU Zhao; DING Chenyang; HAN Zhijie

College of Mechanical Engineering， Hebei University of Science and Technology， Shijiazhuang 050018, China

關(guān)鍵詞:

SLM; 薄壁圓筒; 高強(qiáng)度鋁合金; 掃描策略; 瞬態(tài)溫度場(chǎng)

Keywords:

SLM;  Thin-walled cylinder;  High strength aluminum alloy;  Scanning strategy;  Transient temperature field

分類號(hào):

V261.8

文獻(xiàn)標(biāo)志碼:

A

摘要:

考慮薄壁圓筒與平板結(jié)構(gòu)在SLM成型過程中的差異性，本文基于ANSYS建立了SLM成型的多層多道溫度場(chǎng)薄壁圓筒有限元模型，采用數(shù)值模擬手段研究掃描策略對(duì)薄壁圓筒模型溫度場(chǎng)及應(yīng)力場(chǎng)的影響，結(jié)合“單元生死”技術(shù)描述了Al7075金屬粉末材料的動(dòng)態(tài)增長(zhǎng)過程，得出了瞬態(tài)溫度場(chǎng)及應(yīng)力場(chǎng)的分布狀況。結(jié)果表明：?jiǎn)蔚篱L(zhǎng)度足夠時(shí)，激光已成型部位有充足的時(shí)間消散熱量，不同掃描策略的溫度場(chǎng)優(yōu)勢(shì)也變得比較微弱；不同掃描策略帶來的應(yīng)力優(yōu)勢(shì)仍然存在，即使在溫度優(yōu)勢(shì)變得微弱的情況下，合理的掃描策略仍然可以有效地改善打印件的應(yīng)力狀態(tài)。本文為薄壁圓筒形模型的成型過程熱行為分析提供重要參考。

Abstract:

Considering the difference between thin-walled cylinder and flat structure in SLM forming process, this paper established a multi-layer and multi-channel temperature field finite element model of thin-walled cylinder formed by SLM based on ANSYS, and used numerical simulation to study the influence of scanning strategy on temperature field and stress field of thin-walled cylinder model. The dynamic growth process of Al7075 metal powder was described with the technique of "cell life and death", and the distribution of transient temperature field and stress field were obtained. The results show that when the length of single channel is sufficient, the formed part of laser has enough time to dissipate heat, and the temperature field advantage of different scanning strategies becomes weak. The stress advantage brought by different scanning strategies still exists, even when the temperature advantage becomes weak, a reasonable scanning strategy can still effectively improve the stress state of the printed part. This paper provides an important reference for thermal behavior analysis of thin-walled cylindrical models during molding.