With the continuous reduction of integrated circuit chip size, the size of interconnects is gradually approaching the nanoscale, and interconnects have gone through materials from aluminum to copper, and now the metal cobalt that may replace copper. At present, mainstream chips still use copper as
Carbon fiber reinforced composite/titanium alloy (CFRP/Ti) laminated materials are widely used in the aerospace sector due to their exceptional qualities. The laminated material is typically bolted together during the manufacturing process to create the necessary assembly structure. Improvements in
Nickel based alloys are widely used in industries such as aerospace, energy,and power. However, in some highly corrosive environments, nickel based alloys will suffer severe corrosion damage. In recent years, domestic and foreign scholars have increasingly conducted in-depth research on the corrosio
Compared with the traditional ceramic preparation technology, the stereolithography 3D printing technology has the advantages of high molding accuracy, short production cycle and low cost, which provides a reliable forming process for the preparation of complex structural ceramic components. The key
