[1]吳志晨,堯軍平,李勤,等.Ti摻雜對AlN(0001)/Mg(0001)界面性質影響的第一性原理計算[J].中國材料進展,2025,44(11):060-69.
WU Zhichen,YAO Junping,LI Qin,et al.First principles calculations on interfacial properties of Ti-doped AlN(0001)/Mg(0001) interface[J].MATERIALS CHINA,2025,44(11):060-69.
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Ti摻雜對AlN(0001)/Mg(0001)界面性質影響的第一性原理計算()
中國材料進展[ISSN:1674-3962/CN:61-1473/TG]
- 卷:
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44
- 期數:
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2025年11
- 頁碼:
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060-69
- 欄目:
-
- 出版日期:
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2025-11-28
文章信息/Info
- Title:
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First principles calculations on interfacial properties of Ti-doped AlN(0001)/Mg(0001) interface
- 作者:
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吳志晨; 堯軍平; 李勤; 周蘭民
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南昌航空大學航空制造工程學院,江西 南昌 330063
- Author(s):
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WU Zhichen; YAO Junping; LI Qin; ZHOU Lanmin
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School of aviation manufacturing engineering , Nanchang Aviation University , Nanchang 330063, China
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- 關鍵詞:
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AlN/Mg界面; 粘附功; Ti摻雜; 電子結構; 第一性原理計算
- Keywords:
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AlN/Mg interface; Work of adhesion; Ti-doped; Electronic structure; First-principles calculation
- 文獻標志碼:
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A
- 摘要:
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本文通過使用第一性原理計算方法,研究了不同終端AlN(0001)/Mg(0001)界面模型的穩定性以及添加Ti對AlN(0001)/Mg(0001)界面結合強度和電子結構影響機理。結果表明,N終端FCC位結構的界面模型最為穩定,粘附功高達10.72J/m2,且N終端的AlN/Mg界面相較于Al終端界面要更穩定。隨著Ti元素的引入,N終端FCC位結構的AlN(0001)/Mg(0001)界面的結合強度得到顯著提高。Ti原子的加入增加了界面處的電荷量轉移,與界面處的N原子形成了Ti-N的強共價鍵,從而提高了界面的結合強度和穩定性。
- Abstract:
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In this study the stability of different terminal AlN(0001)/Mg(0001) interface models and the effects of Ti addition on the bonding strength and electronic structure at the AlN(0001)/Mg(0001) interfac are investigated based on first-principles calculations. The calculations results show that the N terminated FCC site interface structure is the most stable interface model, with a work of adhesion as high as 10.72 J/m², and the N-terminated AlN/Mg interface is more stable compared to the Al-terminated interface.The bonding strength of the N-terminated FCC site structure of the AlN(0001)/Mg(0001) interface is significantly enhanced with the addition of Ti. The charge transfer amount is increased with the addition of Ti atoms, the N atoms at the interface, resulting in the formation of strong Ti-N covalent bonds between the N atoms and Ti atoms at the interface. Consequently, the bonding strength and stability of the interface are improved.
更新日期/Last Update:
2025-10-30